Multifunctional Rapid Thermal Conductivity Tester, Hot Disk Method

• Customization: Available
• After-sales Service: One Year
• Warranty: One Year
• Model NO.: TCM-HD
• Thermal Conductivity Measurement Range: 0.001~500W/(M.K), Resolution 0.0001W/(M.K)
• Thermal Diffusion Coefficient (Thermal C: 0.1 ~ 100 M2/S
• Heat Storage Coefficient Range: 0.1~30 W/(M2.K)
• Specific Heat Capacity Range: 0.1~5 Kj/(Kg.ºC)
• Thermal Resistance Range: 0.5~0.000005 mm2.K/W
• Temperature Measurement Accuracy: ≤0.001ºC
• Relative Measurement Error: ≤3%
• Repeatability Error: ≤ 3%
• Test Time: 1~120 Seconds
• Voltage: AC 220V±10%/50/60 Hz
• Power: 500W
• Transport Package: Plywood Packing
• Trademark: Xiangyi
• Origin: China
• Production Capacity: 100 PCS/Month

Product Description

Overview
This instrument uses the transient plane heat source method, based on TPS transient plane heat source technology, and uses a Hot Disk probe. The advantages of this instrument are:

1. Direct measurement of heat spread can save a lot of time;
2. It will not be affected by contact thermal resistance like the static method;
3. No special sample preparation is required. For solid materials, only a relatively flat sample surface is required. Different types of materials use different test plans and computational mathematical models, which have the advantages of fast measurement speed, wide application range, and the ability to successfully avoid the influence of natural convection during the experiment. It has the advantages of wide range of actual test materials, wide range of thermal conductivity, simple sample processing and fast testing speed. It is a popular testing method at present.

Equipment reference standards
ISO 22007-2:2008

Application and test materials
Metal, alloy, graphite, thermal conductive silicone grease, silica gel, silicone rubber, ceramics, geotechnical, rock, polymer, paper, fabric, foam plastic, concrete, composite board, paper honeycomb board and other solids, powders, liquids, Thermal conductivity, thermal conductivity (thermal diffusion coefficient) and specific heat capacity, heat storage coefficient and thermal resistance of pastes, coatings, films, thermal insulation materials, insulation materials, anisotropic materials, etc.

Technical parameters

MODEL	TCM-HD
Thermal conductivity measurement range	0.001~500w/(m.k), resolution 0.0001w/(m.k);
Thermal diffusion coefficient (thermal conductivity coefficient) range	0.1 ~ 100 m2/s;
Heat storage coefficient range	0.1~30 w/(m2.k);
Specific heat capacity range	0.1~5 kJ/(kg.ºC);
Thermal resistance range	0.5~0.000005 mm2.k/w;
Temperature measurement accuracy	≤0.001ºC;
Relative measurement error	≤3%;
Repeatability error	≤ 3%;
Test time	1~120 seconds.
Sample test environment temperature range	room temperature, high and low temperature control (-40~150ºC) is optional, vacuum condition is optional
Probe configuration	diameter Φ15mm Φ30mm, Φ7.5mm, Φ4mm is optional
Test sample requirements	Solid block or round, square or special-shaped samples do not require special preparation. They only require a relatively flat sample surface and are equipped with a special sample clamping device. There are no special requirements for powdery, pasty or liquid substances. It is equipped with a special sample test box. For thinner materials (thickness 0.01~1mm), special test plans and mathematical models are used for testing. High-conductivity materials (100~500W), special test plans and mathematical models for testing. Thermal insulation materials (0.010~0.050W), special test plans and mathematical models for testing.
Software	Use fully automatic testing software to quickly and accurately conduct test process parameter analysis and report output on samples
Voltage	AC 220V±10%/50/60 Hz
Power	500w

Probe technical indicators
 

Heating material	metal nickel;
Operating temperature	-50~150ºC;
Maximum power	20w;
Maximum voltage	20V;
Maximum current	1A;
Resistance	about 15Ω, refer to the resistance value marked on the probe;
Nickel wire specifications	thickness 0.01mm hot wire width 0.35±0.03mm; Hot wire spacing 0.35±0.03mm;
Protective layer material	polyimide film (Kapton); single layer thickness 0.06mm;
Probe diameter	Φ30mm, Φ15mm, Φ7.5mm.
Total thickness of probe (including thickness of adhesive layer)	0.07± 0.02mm